ARE YOU SERIOUS? The guy is putting INSANE amounts of work into this, and has stated that he doesn't want to release anything until it's tested. What are you implying by "It doesn't give me a good feeling"? If you aren't on board, then find another project. The guy's busy, is sticking with what he already stated he would do. And just because he doesn't spoon feed you, you're gonna start getting weird? 

I know he's putting al his time into this, and I now understand he doesn't want to release the schematics before a working product.
It's not about spoon feeding, we all would like to contribute to this and I would like to do my share.
"It doesn't give me a good feeling", sorry, wrong choice of words from my side.
At least now I know why the schematics aren't released yet, but that they will be released in the future.

It's nice that you want to help. I apologize if I came off harsh, but it seemed like you were implying something about the OP, that didn't sit well with me. This forum in general seems to be a giant troll magnet, with people looking for any excuse to sling accusations or passive-aggressive allegations.

That being said, he's stated several times in the thread that he's not going to release schematics until he's absolutely certain that it's ready and fully tested. If anything, that personally gives ME much more confidence, and a "good feeling". I think a lot of people are coming late to the party, and not bothering to read the whole thread. There's a decent amount of fluff in the thread, but if you even just read all the posts by OP (BKKCoins) you will get a pretty good understanding of what's going on, and why.  

I'm not sure if this has come up yet, but seeing the recent thread about someone "reconditioning" their Avalon and mentioning that the pads underneath each chip are lower than the soldermask, it got me thinking...

Would it be better to leave the whole bottom of the board without soldermask?

and...

What kind of surface finish do you plan on using? I believe any type of plating, such as gold, will leave a flat surface. But, HASL will not leave a flat surface, possibly degrading the thermal bond with the heatsink.

I don't think any of these issues are show stoppers but I was wondering what you guys thought.

Edit: Maybe these are not issues if you plan to use a thermal pad.

https://bt.irlbtc.com/view/212090.0 <-- Avalon got it wrong imho. Perhaps a soft thick pad? or the blob of paste under each vias like OP.

In order to keep the board reasonably cheap I won't be able to expose full copper on the bottom. This is because it would require using blind/buried vias so that inner layers don't short out on the bottom. This is why I went with exposed pads under each ASIC, and the tracks running from each ASIC have to clear the pad area to go via.

I'll likely just use HASL for the test boards so I can see how well that works, but I agree with it not being flat and it's likely that final boards would be ENIG (more costly)(depending on just how much trouble the HASL turns out to be). I'm really thinking there will be some 1x1cm pad under each ASIC, at least enough to account for the solder mask thickness.

I'm interested to know exactly what was meant by the person who took apart the Avalon and inspected the heat sink mating. I don't quite have a good image from the comment above. Did he mean it was just heat sink against mask except some exposed areas, or there was solder mask but thin pads that held the heat sink slightly off the mask, or something else?

edit: never mind - just went to see the photos. This makes me feel better...
(because if that works then almost anything will)

Really getting excited about this design . Keep up the good work BKKCoins.. !

Is there a group or company interrested in manifacturing the klondike in Canada?

Great Job. Watching