This is definitely a game changer if they run stable at that rate.

This is a concern, normally for overclock you need strong power supply module, not just only a large PSU. Someone already burnt one of the hash submodule even under 282Mhz, but that could be caused by a bad component. Anyway, I found out that hash rate tends to jump between 50Gh and 100+Gh wildly when heavily overclocked (350Mhz), not a good sign

You're forgetting to overclock when running the AC

AS5 is conductive, if it flows back to the chip through those small tunnels, who knows what will happen. MX4 is non-conductive and also cheaper if you want to apply for all 240 chips (a 20g tube is enough)

Congratulations

Is there enough spacing between the modules to put gpu ram sinks on each individual chip? I have about 2 kg of them, yes kilograms  

Infact just checked how much the bag of them weigh, it was close to 4 kilograms so I should have plenty for 1x3 module avalon once I get it.

I think the highest people have gotten stable with stock B2 is 350MHz ~ 84GH/s on 3 module system.
98GH/s on a 3module system is ~410MHz which I don't think anyone has been stable on.

98GH/s on a 4 module system is ~310MHz which should be fine.
I don't believe that MagicMike523 has stated in this thread what frequency the chips are running at or how many modules.

My guess is that the 98GH/s is lucky variance with a 3 module running at 375MH/s ~90GH/s with some lucky stability and lots of cooling.

Mmmm...nom, nom, nom.

Yes thermal pads would have been a better solution on such a large and uneven surface I'm quite sure. I'm still curious however to see how much individual heat sinks on the chips would make since then you don't have remove the original heat sink. Might take a while to apply them all though 

The exposed metal area under the chips are shallower than the surface of the PCB, if you put a large piece of heatpad then maybe there will still be air gap between the metal part and heat pad, and you can't guarantee a good pressure on all the chips' contact area at the same time, so I think thermal compound is the solution: You put one big drop of the thermal compound on each metal area, and tighten the screws, the thermal compound will spread out depends on the gap distance between chip metal area and the heatsink, so that every chip will get a good contact with heatsink



The result of this handling is reduced temp of 3-4 degree under same fan speed, but since fan speed will always adjust according to temp3, the real effect is just lowered fan speed and maybe 1 degree lower temp. Anyway, you can be sure each chip get maximum cooling now. Then you can also add thermal compound between heatsink and bottom of the case, and cool the bottom of case with an external table fan, this can drop another 3 degree of temp

Another important part is putting screws around VRM area, there is a very hot component at this area, MOSFETS maybe, but not like chips, this component only contact the surface ground layer of PCB, so adding screws will transfer the heat from the surface ground layer directly into heatsink


Since Avalon heatsink are so large, maybe it works even better by taking out those modules and use a large table fan to directly blow on them, or mount many 120mm fans on heatsink like someone did on ASIC miner blades, as long as you reach a certain CFM, the cooling effect should be the same. I usually like the bigger fan solution since it will provide much more airflow and much less noise