You can't just stick 2 or 3 PSUs onto the same device, it'll screw things up big-time. That's what disturbs me, there are TEN power connectors. You'd need at least 3 external powersupplies... that simply will not work. It will fry something, or worse, catch fire.
There's no reason it wouldn't work, I've done it numerous times for odd applications. It's easiest if you get multiple of the same model PSU, but regardless the execution is the same. You tie pin 16 (green/power-on) of all of them together, and when it's grounded they'll all fire up simultaneously. Quality PSUs will do just fine.
Having spoken to some people experienced in ASIC design, is that it's at least 8-12 weeks from tapeout to delivery of first silicon, and at least another 2-3 weeks will be needed for PCB assembly, testing, shipping between factories, etc.
This means that when they made the announcement of 27 May, they must have already known that their tapeout had failed, and there would be a delay of months for the design to be modified and to go through the full sign-off verification process.
I speculated this back in May, as I was familiar with the process as well and their story wasn't adding up. Especially since the design company cut ties with them publicly.
Heck, even the case design shown looks like a joke - there's no way that you'll get 2 kW of silicon cooled in that. Again, they should really have had some test PCBs with dummy loads on, for testing the thermal situation by now.
I'm probably one of the few people who would say you could cool 2kw in a case of that design, you just need to have the proper cooling plan, which I doubt they have. Keep in mind, their design has changed yet again, and they're claiming magical fairy-land efficiency, saying they'll outdo even the KNC giant. Greater efficiency = less heat. Who knows.. maybe they'll pull off the cooling, but that's if this is even legit.
